SMT Assembly
Surface-mount placement and reflow for fine-pitch, high-density boards.
SMT, THT, and mixed-technology assembly on a controlled process with AOI, X-ray and functional test coverage at every stage.
Surface-mount placement and reflow for fine-pitch, high-density boards.
Through-hole placement with wave or selective soldering.
SMT and THT combined on a single board in one production pass.
Cable assembly, enclosure integration and final system-level assembly.
Baseline figures below — confirm exact specs against your board file during DFM review.
| SMT Lines | 6 fully automatic lines |
|---|---|
| Placement Capacity | Up to 500,000 CPH combined |
| Minimum Component | 01005 chip components |
| Placement Accuracy | ±0.025mm (BGA/QFN capable) |
| Board Size Range | 50 x 50mm – 500 x 500mm |
| Max Layer Count | Up to 32 layers |
| Reflow Profile Control | Multi-zone, nitrogen-capable ovens |
| Sample Lead Time | 3–5 business days |
| Mass Production Lead Time | 7–15 business days, volume dependent |
| MOQ | 1 pc accepted for prototype builds |
Every board is verified electrically before it ships — not just visually inspected.
Component and bare-board verification
Automated optical inspection post-placement
BGA/QFN solder joint verification
Electrical and circuit-level testing
Final board-level function verification
Component sourcing, handling and workmanship follow recognized industry standards.
Send your Gerber, BOM and quantity — we'll return feasibility and pricing.